Telefly Telecommunications Equipment Co., Ltd.
Telefly Telecommunications Equipment Co., Ltd.
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HPE Cray XD670
  • HPE Cray XD670HPE Cray XD670
  • HPE Cray XD670HPE Cray XD670
  • HPE Cray XD670HPE Cray XD670
  • HPE Cray XD670HPE Cray XD670

HPE Cray XD670

High quality HPE Cray XD670 is offered by China manufacturer Telefy. Buy HPE Cray XD670 which is of high quality directly with low price.

The HPE Cray XD670 is your ultimate solution. As one of the most advanced air-cooled, rack-mounted servers designed for HPC and AI workloads, the HPE Cray XD670 is purpose-built to accelerate enterprise-level computing across industries. Telefly, a leading China supplier, proudly offers the HPE Cray XD670 for wholesale, discounted prices, and bulk purchasing with flexible years warranty options and detailed pricelists for global clients.


Product Highlights – HPE Cray XD670

The HPE Cray XD670 features an optimized architecture that is engineered for extreme performance, delivering support for dual 4th Gen Intel Xeon Scalable processors, and high-bandwidth memory configurations. It is ideal for enterprises working in sectors such as artificial intelligence (AI), machine learning (ML), scientific computing, financial modeling, energy exploration, and life sciences. Its ability to scale with your business and workload demands makes it a favorite among system integrators and technical professionals seeking wholesale deals on next-generation computing hardware.


Industry Applications

AI & Machine Learning: Supports large-scale model training and inference, with advanced interconnects and high memory bandwidth.

Finance & Risk Analysis: Accelerates Monte Carlo simulations, data analytics, and real-time transaction modeling.

Life Sciences & Healthcare: Enables genome sequencing, molecular modeling, and real-time diagnostics.

Energy & Engineering: Supports seismic imaging, reservoir modeling, and computational fluid dynamics (CFD).

Academic & Government Research: Powers climate modeling, quantum simulations, and big data analysis in national labs.


Technical Specifications

Dual socket system supporting up to 4th Gen Intel Xeon Scalable processors

High-density design: up to 32 DIMMs of DDR5 memory

PCIe Gen5 support for high-speed interconnects and GPUs

Hot-swappable NVMe SSDs and redundant power supply modules

Advanced cooling with optimized airflow for rack-dense deployments

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